Intel Corporation and China-based Lens Technology have announced a strategic collaboration to enable new technologies for advanced semiconductor packaging. The partnership, announced from Santa Clara, California, and Changsha, China, will focus on developing next-generation solutions to support the growing hardware demands of artificial intelligence.
The core of the collaboration is the exploration of glass substrate-based packaging. As AI workloads demand unprecedented interconnect density and performance, traditional organic substrates are facing limitations. Glass substrates promise a path forward with higher performance and density, which are critical for the next generation of AI accelerators and processors.
This partnership combines Intel's semiconductor leadership with Lens Technology's expertise in glass manufacturing and processing. By working together, the companies intend to accelerate the development and adoption of these advanced packaging solutions, aiming to create a more robust supply chain for the high-performance computing components required for AI.