{
  "url": "https://newsroom.intel.com/intel-foundry/intels-us-advanced-packaging-enables-next-generation-ai-semiconductors",
  "htmlSha256": "42c010484a30e99020bb5776ffcd934a1d44f4116f176ef8f300a1b6d807b369",
  "textSha256": "39a516e19dd2a3ee289108fb16617b8742a5d67db8cf482e8cfd763e8d05fe84",
  "status": 200,
  "fetchedAt": "2026-08-03T02:46:53.440Z",
  "excerpt": "Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors - Intel Newsroom Skip to main content (Press Enter) Newsroom Your source for all news Intel Topic 5G & Wireless Altera Artificial Intelligence Automotive Client Computing Corporate Data Center Intel Foundry Intel Products Manufacturing MWC 2026 New Technologies Security Software Type News Opinion Press Kits All Bios • Executive Team • Board of Directors Press Hub Location English Español Deutsch Português 한국어 日本語 简体中文 繁體中文",
  "note": "First 500 characters of extracted page text at the moment this pipeline fetched and verified it, addressed by the SHA-256 of the full archived HTML. Not the live page. See the tape event's source_fetch_checked/entailment_checked payload for the full verification chain."
}